PACK EXPO International 2026 runs Sunday–Wednesday, Oct. 18–21, at McCormick Place in Chicago (exhibits typically 9 a.m.–5 p.m. Sun–Tue; Wed until 3 p.m.). PMMI positions the show as the Western Hemisphere’s densest packaging and processing gathering, with 2,700+ exhibitors across 40+ verticals — details at packexpointernational.com/the-show.
For flour and corn tortilla plants, priority themes remain oxygen-barrier and MAP films for soft packs, high-speed date coding that survives cold-chain condensation, modular case packing for SKU-heavy books, and inspection/weighing systems that satisfy QSR and retail audits.
Heat and Control plans booth N-4706 with snack and prepared-food processing, seasoning, conveying, multihead weighing, VFFS packaging, and inspection demos — useful for plants that fry chips, season, or bag adjacent to tortilla lines. See heatandcontrol.com/event/pack-expo-international-2026 for the vendor agenda and registration comp code.
Use the show to shortlist vendors for Q1 capital requests and to compare service footprints near your plants.
Heat and Control